1～3 item / All 3 items
This is a device for visual inspection and thickness measurement of 8-inch silicon wafers.
- Visual inspection can be easily performed using JOG stick operation. - Alignment is performed based on the notch position, and clamping measurement is conducted using a capacitive sensor.
It is a semi-automatic device for visual inspection of 8-inch silicon wafers.
The cassette containing the wafers will be automatically transported to the inspection stage. Based on the pass/fail judgment results from the operator, the cassette for inserting the wafers will be selected and transported.
Pass/Fail Judgment Device
It is a device that detects scratches on the front and back surfaces of silicon wafers through image processing and determines pass or fail.
